Method to provide a void between adjacent conducting lines in a

Details Method to provide a void between adjacent conducting lines in a Method to provide a void between adjacent conducting lines in a

1995-06-07

1997-02-04

Tsai, H. Jey

Fishing, trapping, and vermin destroying

437247, 437982, H01L 2128

Patent

active

055997457

ABSTRACT:
The invention proposes methods for producing integrated circuits wherein the dielectric constant between closely spaced and adjacent metal lines is approaching 1. One method of the invention uses low-melting-point dielectric to form a barrier from a void between conductive lines by heating the dielectric. Another method of the invention uses sidewall film to form a similar barrier.

REFERENCES:
patent: 5001079 (1991-03-01), Van Laarhoven et al.
patent: 5192715 (1993-03-01), Sliwa, Jr. et al.
patent: 5310700 (1994-05-01), Lien et al.
patent: 5324683 (1994-06-01), Fitch et al.
patent: 5335219 (1994-08-01), Ovshinsky et al.
patent: 5407860 (1995-04-01), Stoltz et al.

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