Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor
Reexamination Certificate
2005-10-25
2005-10-25
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Compound semiconductor
C257S011000
Reexamination Certificate
active
06958254
ABSTRACT:
A method of producing a very large area germanium layer on a silicon substrate, comprises forming an initial layer of germanium on the silicon substrate such that rounded S—K protuberances are produced by lattice mismatch. Oxidation produces silicon dioxide between the protuberances, and a subsequent reduction step exposes the tops of the protuberances. Since the top regions are almost perfectly relaxed and free of stress, these form nucleation sites for the subsequent growth of a final layer of germanium, formed as single crystals each extending from a nucleation site.
REFERENCES:
patent: 5245206 (1993-09-01), Louis et al.
patent: 5259918 (1993-11-01), Akbar et al.
patent: 5286334 (1994-02-01), Shahzad et al.
patent: 5405453 (1995-04-01), Frank et al.
patent: 6117750 (2000-09-01), Daniel et al.
patent: 2002/0075924 (2002-06-01), Mukai
patent: 195 22 054 (1996-11-01), None
patent: 0 518 800 (1992-12-01), None
patent: 2 783 254 (2000-03-01), None
patent: 10-289996 (1998-10-01), None
patent: WO 99 19546 (1999-04-01), None
BTG International Limited
Lee Calvin
Miles & Stockbridge P.C.
LandOfFree
Method to produce germanium layers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method to produce germanium layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to produce germanium layers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3454110