Method to predict and identify defocus wafers

Details Method to predict and identify defocus wafers Method to predict and identify defocus wafers

2007-11-27

2007-11-27

Nguyen, Sang H. (Department: 2886)

Photocopying

Projection printing and copying cameras

Focus or magnification control

C355S053000, C356S399000, C356S401000

Reexamination Certificate

active

10786495

ABSTRACT:
A method and system for identifying a defocus wafer by mapping a topography of each wafer in a first wafer batch using a level sensor apparatus (100); calculating a focus spot deviation (402) from the data, the focus spot deviation (402) corresponding to a height by which a focus spot of a photo exposure module would be defocused by the topography; converting the focus spot deviation (402) to a corresponding wafer stage set point to which the photo exposure module is set, to focus the focus spot on each wafer in the wafer batch; and identifying a defocus wafer in the wafer batch, as a wafer having a topography that would defocus the focus spot, even when the photo exposure module is set to the wafer stage set point.

REFERENCES:
patent: 4890239 (1989-12-01), Ausschnitt et al.
patent: 5283141 (1994-02-01), Yoon et al.
patent: 6432829 (2002-08-01), Muller et al.
patent: 6674510 (2004-01-01), Jasper et al.
patent: 6975407 (2005-12-01), Wang et al.

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