Data processing: structural design – modeling – simulation – and em – Simulating electronic device or electrical system – Power system
Reexamination Certificate
2005-08-16
2005-08-16
Phan, Thai (Department: 2128)
Data processing: structural design, modeling, simulation, and em
Simulating electronic device or electrical system
Power system
C703S013000, C703S014000, C703S006000, C716S030000, C716S030000
Reexamination Certificate
active
06931369
ABSTRACT:
A method and apparatus for thermally simulating a circuit over a network is provided. Techniques are provided for designing a circuit that satisfies user-specified functional requirements received over a network. Based on the specified requirements, components and a topology for constructing the circuit are automatically determined. The components determined during this operation have operational values such that, when the components are arranged according to the topology to form the circuit, the circuit satisfies the user-specified functional requirements. One or more web pages that identify the components are then delivered to the browser over the network. The component and topology information may be used to generate a schematic diagram that is delivered in a web page to the user over the network. The user may thermally simulate the designed circuit. Many characteristics of the board may be adjusted to provide an accurate thermal simulation. The user may place an order over the network for one of the components, a kit of all of the components, a custom made circuit made from the components, and/or a prefabricated circuit that is functionally similar to the one that was designed.
REFERENCES:
patent: 5018005 (1991-05-01), Lin et al.
patent: 5631469 (1997-05-01), Carrieri et al.
patent: 5751554 (1998-05-01), Williams et al.
patent: 5847968 (1998-12-01), Miura et al.
patent: 5901047 (1999-05-01), Gonsalves et al.
patent: 5973929 (1999-10-01), Arakawa et al.
patent: 6043987 (2000-03-01), Goodwin et al.
patent: 6075711 (2000-06-01), Brown et al.
patent: 6147876 (2000-11-01), Yamaguchi et al.
patent: 6288908 (2001-09-01), Saitoh
patent: 6301122 (2001-10-01), Ishikawa et al.
patent: 6353540 (2002-03-01), Akiba et al.
patent: 6353915 (2002-03-01), Deal et al.
patent: 6389582 (2002-05-01), Valainis et al.
patent: 6414850 (2002-07-01), Kozak et al.
patent: 6418030 (2002-07-01), Yamaguchi et al.
patent: 6420937 (2002-07-01), Akatsuka et al.
patent: 6424959 (2002-07-01), Bennett, III et al.
patent: 6483719 (2002-11-01), Bachman
patent: 6484301 (2002-11-01), Burden
patent: 6578176 (2003-06-01), Wang et al.
patent: 2002/0015293 (2002-02-01), Akiba et al.
patent: 2002/0076851 (2002-06-01), Eden et al.
patent: 2002/0083398 (2002-06-01), Takeyama et al.
patent: 2002/0156757 (2002-10-01), Brown
Fukumoto et al., “A method of automatic placement that reduces electromagnetic radiation noise from digital printed circuit boards”,IEEE International Symposium on Electromagnetic Compatibility, vol. 1, Aug. 21, 2000, pp. 363-368.
Khan et al., “Yield-based system partitioning strategies for MCM and ASEM Design”,Proceedings of 1994 IEEE Multi-Chip Module Conference, Mar. 15, 1994, pp. 144-149.
Allison, III Rex L.
Garrett Wanda Carol
Garrison Martin
Gibson Phil
Levin Richard
Merchant & Gould
National Semiconductor Corporation
Phan Thai
Sullivan Timothy P.
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