Method to monitor substrate viability by a sensor mounted to...

Details Method to monitor substrate viability by a sensor mounted to... Method to monitor substrate viability by a sensor mounted to...

2007-08-07

2010-06-22

Nguyen, Vinh P (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

C324S765010

Reexamination Certificate

active

07741834

ABSTRACT:
Method for detecting and reporting a condition. The components of the invention include an electronic package having a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package.

REFERENCES:
patent: 5070296 (1991-12-01), Priebe
patent: 5606264 (1997-02-01), Licari et al.
patent: 6407569 (2002-06-01), Boettler et al.
patent: 6734693 (2004-05-01), Nakayama
patent: 2005/0086021 (2005-04-01), Khandros et al.
Rao R. Tummala et al., Semiconductor Packaging, Microelectronics Packaging Handbook, 1997, 34-36.
S.L. Buchwalter et al., Effects of mechanical stress and moisture on packaging interfaces, 663-675 vol. 49 No. 4/5 Jul./Sep. 2005.
E.D. Blackshear et al., The evolution of build-up package technology and its design challenges, 641-661 vol. 49 No. 4/5 Jul./Sep. 2005.

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