Method to minimize watermarks on silicon substrates

Details Method to minimize watermarks on silicon substrates Method to minimize watermarks on silicon substrates

1997-09-15

1999-08-03

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

134 2, 134 26, 216 99, 438748, H01L 2100

Patent

active

059324937

ABSTRACT:
Formation of watermarks during semiconductor processing can be prevented by rinsing silicon wafers in an organic solvent prior to drying. Water droplets on the silicon wafer surface are taken up by the solvent and film is formed over the wafer surface. Following this rinse, the wafer may be subjected to standard IPA-based drying techniques.

REFERENCES:
patent: 4968381 (1990-11-01), Prigge et al.
patent: 5409544 (1995-04-01), Ota et al.
patent: 5520744 (1996-05-01), Fujikawa et al.
patent: 5593538 (1997-01-01), Davison et al.
A. Adamson; Surface Films On Liquid Substrates; Physical Chemistry of Surfaces; 4.sup.th Edition; pp. 104-107.
R. Hunter et al.; Emulsions; Foundation of Colloid Science; vol. 2, pp. 916-919.
A. Adamson; Emulsions And Foams; Physical Chemistry of Surfaces; 4.sup.th edition; pp. 474-477.
G. Gould et al.; An In Situ Study Of Aqueous HF Treatment Of Silicon By Contact Angle Measurement And Ellipsometry; J. Electrochem. Soc., vol. 135, No. 6, Jun. 1988 pp. 1535-1539.
Jin-Goo Park et al.; Effects Of Drying Methods And Wettability Of Silicon On The Formation Of Water Marks In Semiconductor Processing; J. Electrochem. Soc., vol. 142, No. 6, Jun. 1995 pp. 2028-2031.

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