Method to measure oxide thickness by FTIR to improve an...

Data processing: measuring – calibrating – or testing – Measurement system – Dimensional determination

Reexamination Certificate

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Reexamination Certificate

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06895360

ABSTRACT:
A method for determining a material layer thickness transmissive to infrared (IR) energy in a semiconductor wafer manufacturing process including providing at least one semiconductor wafer comprising an IR transmissive layer; passing IR energy through the IR transmissive layer to produce at least one Fourier transform infrared (FTIR) spectrum; and, determining an amount of the IR transmissive layer present according to an amount of IR energy absorbed by a predetermined contributing characteristic vibrational mode portion of the FTIR spectrum.

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