Data processing: measuring – calibrating – or testing – Measurement system – Dimensional determination
Reexamination Certificate
2005-05-17
2005-05-17
Pretlow, Demetrius R. (Department: 2863)
Data processing: measuring, calibrating, or testing
Measurement system
Dimensional determination
Reexamination Certificate
active
06895360
ABSTRACT:
A method for determining a material layer thickness transmissive to infrared (IR) energy in a semiconductor wafer manufacturing process including providing at least one semiconductor wafer comprising an IR transmissive layer; passing IR energy through the IR transmissive layer to produce at least one Fourier transform infrared (FTIR) spectrum; and, determining an amount of the IR transmissive layer present according to an amount of IR energy absorbed by a predetermined contributing characteristic vibrational mode portion of the FTIR spectrum.
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Jang Syun-Ming
Liu Ai-Sen
Pretlow Demetrius R.
Taiwan Semiconductor Manufacturing Co. Ltd.
Tung & Associates
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