Method to increase throughput in a dual substrate stage...

Details Method to increase throughput in a dual substrate stage... Method to increase throughput in a dual substrate stage...

2005-04-05

2005-04-05

Nguyen, Henry Hung (Department: 2851)

Photocopying

Projection printing and copying cameras

Methods

C355S053000

Reexamination Certificate

active

06876439

ABSTRACT:
A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns the first set of substrates and a second set of substrates, and during a third exposure period the first reticle patterns the second set of substrates, etc. This can continue with further pairs of substrates until all desired substrates are patterned. It is to be appreciated that after the first and second reticles are complete, third and fourth reticles can pattern the first and second, sets of substrates. As another example, other sequences can also be performed using four exposure periods.

REFERENCES:
patent: 5677758 (1997-10-01), McEachern et al.
patent: 5897986 (1999-04-01), Dunn et al.
patent: 6134008 (2000-10-01), Nakao
patent: 6628372 (2003-09-01), McCullough et al.

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