Abrasive tool making process – material – or composition – With inorganic material
Reexamination Certificate
2007-02-13
2007-02-13
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With inorganic material
C051S308000, C051S309000, C106S003000
Reexamination Certificate
active
10997607
ABSTRACT:
Methods and solutions for forming self assembled organic monolayers that are covalently bound to metal interfaces are presented along with a device containing a self assembled organic monolayer. Embodiments of the present invention utilize self assembled thiolate monolayers to prevent the electromigration and surface diffusion of copper atoms while minimizing the resistance of the interconnect lines. Self assembled thiolate monolayers are used to cap the copper interconnect lines and chemically hold the copper atoms at the top of the lines in place, thus preventing surface diffusion. The use of self assembled thiolate monolayers minimizes the resistance of copper interconnect lines because only a single monolayer of approximately 10 Å and 20 Å in thickness is used.
REFERENCES:
patent: 6194317 (2001-02-01), Kaisaki et al.
patent: 6323131 (2001-11-01), Obeng et al.
patent: 6569707 (2003-05-01), Dimitrakopoulos et al.
patent: 2002/0177316 (2002-11-01), Miller et al.
patent: 2003/0083214 (2003-05-01), Kakizawa et al.
patent: 2003/0168627 (2003-09-01), Singh et al.
patent: 2003/0175551 (2003-09-01), Smith et al.
patent: 2004/0132308 (2004-07-01), Obeng
Gandikota, Srinivas, et al., Cobalt Alloy Thin Films for Encapsulation of Copper, Applied Materials, Inc., 3303 Scott Boulevard, Santa Clara, CA 95054, Advanced Metallization Conference, 2002, pp. 1-3.
Hu, C.-K, et al., Reduced electromigration of Cu wires by surface coating; Applied Physics Letters, vol. 81, No. 10, Sep. 2, 2002, pp. 1782-1784, © 2002 American Institute of Physics.
Laibinis, Paul E., et al., Self-Assembled Monolayer ofn-Alkanethiolates on Copper Are Barrier Films That Protect the Metal against Oxidation by Air1, Journal of the American Chemical Society, vol. 114, No. 23, Nov. 4, 1992, pp. 9022-9028, © 1992 American Chemical Society.
Laibinis, Paul E., et al., Comparison of the Structures and Wetting Properties of Self-Assembled Monolayers ofn-Alkanethiols on the Coinage Metal Surfaces, Cu, Ag, Au1, Journal of the American Chemical Society, vol. 113, No. 19, Sep. 11, 1991, pp. 7152-7167, © 1991 American Chemical Society.
Padhi, Deenesh, et al., Electrodeposition of Copper-Tin Alloy for Enhancement of Electromigration and Stress Migration Resistance in ULSI Era, Applied Materials, Inc, 3303 Scott Bouelvard, Santa Clara, CA 95054, Advanced Metallization Conference, 2002, pp. 1-2.
Usmani, S., et al., Use of BTA for Corrosion Protection and Surface Modification of Cu in Post-CMP Rinses, Motorola, Austin, TX 78721, AMD Fab30, Dresden, Germany, Advanced Metallization Conference, 2002, 2 pages.
Wasserman, Stephen R., et al., Monolayers of 11-trichlorosilylundecyl thioacetate: A system that promotes adhesion between silicon dioxide and evaporated gold, Journal of Materials Research, vol. 4, No. 4, Jul./Aug. 1989, Published by the Materials Research Society, pp. 886-892.
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