Method to improve wetting of peelable adhesive structures

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156322, 1563244, 156330, 156315, 156334, 215347, 40311, 428458, 428460, 428461, 428463, C09J 504, B65D 4112, B32B 1508

Patent

active

043303536

ABSTRACT:
A method of manufacturing peelable adhesive structures. It comprises preparing a first paint solution containing vinyl resin and a stably emulsified hydrocarbon or natural resin having softening point less than 180.degree. C. and concentration between 50 and 200 parts by weight per 100 parts of vinyl resin dispersed in a continuous phase of the vinyl resin. The first paint solution is applied onto a metal base material (1) to form a first coating layer (2). A second coating layer (3) is formed by applying a second paint solution containing epoxy resin and polyethylene oxide at a concentration of between 0.5 and 90 weight percent of epoxy resin over the first coating layer. The first and second coating layers have thicknesses ranging from about 0.5 to 100 mg/m.sup.2. A layer of olefin resin (4) is joined to the second coating layer. The method is further characterized in that at least one of the coating layers comprises a peeling imparter at a concentration of between 50 and 200 parts by weight per 100 parts by weight of resin, and a substantially linear saturated polyester wetting improver at a concentration of between about 2 and 50 parts by weight per 100 parts by weight of resin and having a molecular weight of between about 5,000 and about 50,000. The resulting peelable adhesive structure has a peeling strength between about 0.05 and 5 kg/cm between the first (2) and the second (3) coating layers.

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