Method to improve uniformity and reduce excess undercuts during

Details Method to improve uniformity and reduce excess undercuts during Method to improve uniformity and reduce excess undercuts during

1996-06-06

1997-04-15

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating electrical conductor article

216 95, 216108, 437183, 437192, 438614, 438751, H01L 2348

Patent

active

056206119

ABSTRACT:
Reduced undercutting of a titanium-tungsten layer in a ball limiting metallurgy (BLM) is achieved in the preparation of solder ball interconnect structures by removing metal oxide film which forms on the titanium-tungsten layer and etching the titanium-tungsten layer in different steps. Removing the metal oxide with an acid solution prior to etching the titanium-tungsten layer provides for a more uniform etch of the titanium-tungsten layer.

REFERENCES:
patent: 4787958 (1988-11-01), Lytle
patent: 5248632 (1993-09-01), Tung et al.
patent: 5376584 (1994-12-01), Agarwala
patent: 5384283 (1995-01-01), Gengenwarth et al.
patent: 5418186 (1995-05-01), Park et al.
patent: 5462638 (1995-10-01), Datta et al.

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