Method to improve flexible foil substrate for thin film...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C438S072000, C438S073000, C257SE31003, C257SE27118, C257SE25004, C257SE25009

Reexamination Certificate

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07824947

ABSTRACT:
A thin film solar cell including a Group IBIIIAVIA absorber layer on a defect free base including a stainless steel substrate is provided. The stainless steel substrate of the base is surface treated to remove the surface roughness such as protrusions that cause shunts. Before removing the protrusions, a thin protective ruthenium film is first deposited on the recessed surface portions of the substrate to protect these portions during the following protrusion removal. The protrusions on the surface receives very little or no ruthenium during the deposition. After the ruthenium film is formed, the protrusions are etched and removed by an etchant which only attacks the stainless steel but neutral to the ruthenium film. A contact layer is formed over the ruthenium layer and the exposed portions of the substrate to complete the base.

REFERENCES:
patent: 6379476 (2002-04-01), Tarutani et al.
patent: 2001/0029978 (2001-10-01), Nakai et al.
Basol, Bulent M., et al., “Status of Flexible CIS Research at ISET”,NASA Document ID; 19950014096, Accession No. 95N-20512, pp. 101-106.
Basol, Bulent M., et al., “Modules and Flexible Cells of CuInSe2”,Proc. of the 23rdPhotovoltaic Spec. Conf., 1993, pp. 426-430.

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