Method to getter contamination in semiconductor devices

Fishing – trapping – and vermin destroying

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437 12, 148DIG24, 148DIG60, H01L 21308

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active

052448193

ABSTRACT:
A frontside gettering method for removing metallic contamination from a thin film SOI or SOS silicon device. Damage sites are created by ion implantation into inactive regions of a silicon substrate. An annealing step causes metallic contamination to diffuse from the active device region to the inactive region. The inactive region material is removed prior to subsequent processing steps.

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