Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Patent
1999-11-19
2000-12-12
Pham, Long
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
438618, 438622, 438637, 438675, 257 59, 257 72, H01L 2100
Patent
active
061597597
ABSTRACT:
A new method of forming liquid crystal displays has been achieved. Metal conductors are provided in an insulating layer overlying a semiconductor substrate. A first isolation layer is deposited. A first silicon nitride layer is deposited. The first silicon nitride layer is patterned to form openings for planned vias overlying the metal conductors. A second isolation layer is deposited. A second silicon nitride layer is deposited. The second silicon nitride layer is patterned to form masks overlying where dummy supports for the metal pixels are planned and to form openings to extend the planned vias. A third isolation layer is deposited. The third isolation layer is patterned to form openings for the planned metal pixels. The second isolation layer and the first isolation layer are etched through to complete the vias and the dummy supports. A metal layer is deposited filling the openings for the metal pixels, the dummy support, and the vias. The metal layer is polished down to the top surface of the third isolation layer to complete the metal pixels. A thin film passivation is deposited. A liquid crystal layer is deposited. A transparent image point electrode is formed to complete the liquid crystal display.
REFERENCES:
patent: 5614427 (1997-03-01), den Boer et al.
patent: 5693237 (1997-12-01), Bodensohn
patent: 5852481 (1998-12-01), Hwang
patent: 5879959 (1999-03-01), Chen
Chu Shao-Fu Sanford
Lee Cerdin
Shao Kai
Xu Yi
Chartered Semiconductor Manufacturing Ltd.
Pham Long
Pike Rosemary L. S.
Saile George O.
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