Semiconductor device manufacturing: process – Making device array and selectively interconnecting
Patent
1998-06-18
2000-08-08
Nguyen, Tuan H.
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
438132, 438601, H01L 2182
Patent
active
061001163
ABSTRACT:
A method for forming protection layers completely around a metal fuse to protect the metal fuse 74A and metal lines 74B from moisture corrosion from fuse opening and micro-cracks in dielectric layers. The invention surrounds the fuse on all sides with two protection layers: a bottom protection layer 70 and a top protection layer 78. The top protection layer 78 is formed over the fuse metal, the sidewalls of the metal fuse and the bottom protection layer 70. The protection layers 70 78 of the invention form a moisture proof seal structure around the metal fuse 74A and protect the metal fuse 74A and metal lines 74B from moisture and contaminates.
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Chiang Min-Hsiung
Huang Jenn Ming
Lee Yu-Hua
Shih Cheng-Yeh
Wu James
Ackerman Stephen B.
Nguyen Tuan H.
Saile George O.
Stoffel William J.
Taiwan Semiconductor Manufacturing Company
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