Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2005-08-16
2005-08-16
Wille, Douglas A. (Department: 2814)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S712000
Reexamination Certificate
active
06930051
ABSTRACT:
New methods for fabrication of silicon microstructures have been developed. In these methods, an etching delay layer is deposited and patterned so as to provide differential control on the depth of features being etched into a substrate material. Structures having features with different depth can be formed thereby in a single etching step.
REFERENCES:
patent: 5348619 (1994-09-01), Bohannon et al.
patent: 5554554 (1996-09-01), Bastiani et al.
IBM TDB NB82081402, Aug. 1982, pp 1402-1403.
Manginell Ronald P.
Schubert W. Kent
Shul Randy J.
Bieg Kevin
Dodson Brian
Sandia Corporation
Wille Douglas A.
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