Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2005-08-09
2005-08-09
Phasge, Arun S. (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S209000, C205S224000, C438S598000, C438S612000, C438S760000
Reexamination Certificate
active
06926818
ABSTRACT:
A method of forming a bump structure through the use of an electroplating solution, comprising the following steps. A substrate having an overlying conductive structure is provided. A patterned dry film resist is formed over the conductive structure. The patterned dry film resist having a trench exposing a portion of conductive structure. The patterned dry film resist adhering to the conductive structure at an interface. The structure is treated with a treatment that increases the adherence of the patterned dry film resist to the conductive structure at the interface. A conductive plug is over the exposed portion of the conductive structure within the trench through the use of the electroplating solution. The increased adhesion of the patterned dry film resist to the conductive structure at the interface preventing the electroplating solution from penetrating the interface of the patterned dry film resist and the conductive structure during the formation of the conductive plug. The patterned dry film resist is removed from the conductive structure. The conductive plug is reflowed to form the bump structure.
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Ching Kai-Ming
Lin Yih-Ann
Lu Kuo-Liang
Pan Sheng-Liang
Shie Tung-Heng
Phasge Arun S,.
Taiwan Semiconductor Manufacturing Co. Ltd.
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