Method to eliminate undulations in a composite panel

Details Method to eliminate undulations in a composite panel Method to eliminate undulations in a composite panel

2006-05-30

2006-05-30

Aftergut, Jeff H. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S307700, C244S131000, C264S102000

Reexamination Certificate

active

07052573

ABSTRACT:
A method and article of manufacture of joining a stringer to a wing or tail panel and curing a wing or tail panel is disclosed. A sheet of titanium is placed between a cured stringer and an uncured wing or tail panel. The stringer, wing or tail panel and sheet are then placed within a vacuum bag, and gas is pumped out of the bag. The bag is then placed in an auto-clave to cure the wing or tail panel.

REFERENCES:
patent: 4981753 (1991-01-01), Ohta et al.
patent: 5648424 (1997-07-01), Miwa et al.
patent: 5814137 (1998-09-01), Blohowiak et al.
patent: 5849110 (1998-12-01), Blohowiak et al.
patent: 5869140 (1999-02-01), Blohowiak et al.
patent: 5869141 (1999-02-01), Blohowiak et al.
patent: 5939007 (1999-08-01), Iszczyszyn et al.
patent: 5939197 (1999-08-01), Blohowiak et al.
patent: 5958578 (1999-09-01), Blohowiak et al.
patent: 6037060 (2000-03-01), Blohowiak et al.
patent: 6527894 (2003-03-01), Rocker et al.
patent: 6849150 (2005-02-01), Schmidt
patent: 1 134 070 (2001-09-01), None
patent: 11207868 (1999-08-01), None
English abstract for JP 11207868.
International Search Report mailed Dec. 16, 2005.

Affiliated with

Also associated with

Rating

Method to eliminate undulations in a composite panel does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to eliminate undulations in a composite panel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to eliminate undulations in a composite panel will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3566391