Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1996-11-08
1999-02-09
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 20, 216 65, 428209, B44C 122
Patent
active
058689508
ABSTRACT:
A method of forming a via in a laminated substrate by placing a first mask between an output optics of a laser and an exposed surface of a laminated substrate. The first mask has a first aperture corresponding to a location of a via in the substrate. A second mask is placed between the first mask and the output optics of the laser. The second mask has a second aperture disposed within a main beam of a laser beam output from the laser and blocks side lobes of the laser beam from reaching the exposed surface of the substrate.
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Genco, Jr. Victor M.
Powell William
W. L. Gore & Associates, Inc.
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