Method to control cavity dimensions of fired multilayer circuit

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Other Related Categories

156 8912, 156182, 156252, 156253, 156278, 156280, 29851, 428210, 428901, 174255, B32B 3118, B32B 3126

Type

Patent

Status

active

Patent number

058581456

Description

ABSTRACT:
Patterned laminated green tape multilayer stacks can be fired while maintaining the dimensions of the pattern by applying, as by screen printing or spraying, a ceramic ink over surface portions of the green tape stack. Complex patterns can be formed in the green tapes by punching openings in one or more of the laminated green tape stacks before laminating them together.

REFERENCES:
patent: 4710250 (1987-12-01), Kojima et al.
patent: 4837408 (1989-06-01), Kondo et al.
patent: 4920640 (1990-05-01), Enloe et al.
patent: 5085720 (1992-02-01), Mikeska et al.
patent: 5130067 (1992-07-01), Flaitz et al.
patent: 5254191 (1993-10-01), Mikeska et al.
patent: 5277724 (1994-01-01), Prabhu
patent: 5370759 (1994-12-01), Hakotani et al.
patent: 5456778 (1995-10-01), Fukuta et al.
patent: 5470412 (1995-11-01), Fukuta et al.
patent: 5480503 (1996-01-01), Casey et al.
patent: 5538582 (1996-07-01), Natarajan et al.
patent: 5581876 (1996-12-01), Prabhu et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method to control cavity dimensions of fired multilayer circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to control cavity dimensions of fired multilayer circuit , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to control cavity dimensions of fired multilayer circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1510572

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.