Method to assemble structures from nano-materials

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S040000, C257SE29071, C257SE29094, C438S618000, C977S788000

Reexamination Certificate

active

07633080

ABSTRACT:
Numerous embodiments of a method to assemble nano-materials on a platform are described. In one embodiment, a nano-material is functionalized with a first bondable group. The functionalized nano-material is disposed on an assembly platform having an electrode to form a first layer. Additional layers of the nano-material may be formed above the first layer to form a semiconductor device. In one embodiment, the nano-material may be a carbon nanotube.

REFERENCES:
patent: 2005/0045867 (2005-03-01), Ozkan et al.
patent: 2005/0056828 (2005-03-01), Wada et al.
patent: 2005/0136483 (2005-06-01), Carlson
patent: 2005/0164432 (2005-07-01), Lieber et al.
patent: 2006/0063178 (2006-03-01), Rauh-Adelmann et al.
patent: 2008/0038830 (2008-02-01), Ure et al.
patent: 2008/0153105 (2008-06-01), Martin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method to assemble structures from nano-materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to assemble structures from nano-materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to assemble structures from nano-materials will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4144042

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.