Method to achieve regulated force contact in pin transfer deposi

Details Method to achieve regulated force contact in pin transfer deposi Method to achieve regulated force contact in pin transfer deposi

1996-04-18

1997-10-14

Heinrich, Samuel M.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228223, H05K 334

Patent

active

056763050

ABSTRACT:
A method for depositing a tacking agent (18) onto a circuit-carrying substrate (e.g., a printed circuit board) (22) such that a regulated volume is simultaneously deposited at multiple substrate sites (24). A first input pressure, P1, introduced through a bladder inlet (12), is supplied to a compliant bladder (14) which is in contact with a plurality of transfer pins (16). The compliant bladder imparts a substantially equal force to each of the transfer pins. The pins are then dipped into a thin film of tacking agent and removed. Subsequently, the first input pressure, P1, is adjusted to a second input pressure, P2, sufficient to force the pins to a uniform maximum extension. Finally, the second input pressure, P2, is adjusted to a third input pressure, P3, which imparts a predetermined uniform force on each of the pins, and the pins are brought in contact with the printed circuit substrate deposition sites. Thus, a uniform, predetermined volume of tacking agent is transferred to each of the board deposition sites, by regulating the force applied to the plurality of pins.

REFERENCES:
patent: 5315070 (1994-05-01), Maiwald
patent: 5435481 (1995-07-01), Da Costa Alves et al.
patent: 5540379 (1996-07-01), Sofia et al.

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