Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2011-01-25
2011-01-25
Toledo, Fernando L (Department: 2895)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S106000, C438S107000, C438S108000, C438S109000, C438S110000, C438S111000, C438S112000, C438S113000, C438S114000, C438S115000, C438S116000, C438S117000, C438S118000, C438S119000, C438S120000, C438S121000, C438S122000, C438S123000, C438S125000, C438S124000, C438S126000, C438S127000, C438S052000, C257S432000
Reexamination Certificate
active
07875528
ABSTRACT:
A method, system and program product for bonding two circuitry-including semiconductor substrates, and a related stage, are disclosed. In one embodiment, a method of bonding two circuitry-including substrates includes: providing a first stage for holding a first circuitry-including substrate and a second stage for holding a second circuitry-including substrate; identifying an alignment mark on each substrate; determining a location and a topography of each alignment mark using laser diffraction; creating an alignment model for each substrate based on the location and topography the alignment mark thereon; and bonding the first and second circuitry-including substrates together while aligning the first and second substrate based on the alignment model.
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La Tulipe, Jr. Douglas C.
Steen Steven E.
Topol Anna W.
Hoffman Warnick LLC
International Business Machines - Corporation
Percello Louis J.
Singal Ankush k
Toledo Fernando L
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