Method, system, and apparatus for a secure bus on a printed...

Details Method, system, and apparatus for a secure bus on a printed... Method, system, and apparatus for a secure bus on a printed...

2009-10-23

2010-12-21

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S617000, C257SE21499

Reexamination Certificate

active

07855102

ABSTRACT:
A method, apparatus, and system, the apparatus including, in some embodiments, a printed circuit board (PCB), an integrated circuit (IC) positioned over and electrically connected to the PCB, a chip positioned between the PCB and the IC, and a closed boundary barrier between and contacting the PCB and the IC to define an inner containment area that completely contains the chip within the inner containment area.

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