Method of wiring semiconductor device using energy beam

Details Method of wiring semiconductor device using energy beam Method of wiring semiconductor device using energy beam

1992-04-27

1994-04-26

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437187, 437204, 437245, H01L 21285

Patent

active

053066634

ABSTRACT:
A method of wiring a semiconductor device which allows a manufacturing step to be simplified without deteriorating an insulation characteristic of an aerial wiring. The semiconductor device wiring apparatus formed thereby includes a first beam column 1a disposed above a substrate 50 and a second beam column 1b disposed horizontally thereto. A wiring portion of the aerial wiring to be formed upwardly is formed by using the first beam column 1a and a wiring portion to be formed horizontally to wiring layer of the substrate 50 is formed by using the second beram column, which results in that no insulating film for the aerial wiring is required to simplify manufacturing steps.

REFERENCES:
patent: 4457803 (1984-07-01), Takigawa
patent: 4609809 (1986-09-01), Yamaguchi et al.
patent: 4874947 (1989-10-01), Ward et al.

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