Method of wiring formation and method for manufacturing...

Details Method of wiring formation and method for manufacturing... Method of wiring formation and method for manufacturing...

2008-01-08

2008-01-08

Kackar, Ram N. (Department: 1763)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S018000, C216S040000, C216S100000, C205S080000, C205S123000, C205S125000, C205S223000, C205S169000, C205S157000, C205S186000, C438S727000, C438S643000, C438S648000, C438S653000

Reexamination Certificate

active

07316783

ABSTRACT:
A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.

REFERENCES:
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patent: 5080763 (1992-01-01), Baigetsu
patent: 5336929 (1994-08-01), Hayashi
patent: 5550068 (1996-08-01), Hirano et al.
patent: 5679234 (1997-10-01), Imamura
patent: 02-139934 (1990-05-01), None
patent: 04-262536 (1992-09-01), None
patent: 6-260482 (1994-09-01), None

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