Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2000-06-09
2002-10-01
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S842000, C228S001100
Reexamination Certificate
active
06457235
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to an integrated circuit device and a wire-bonding method for bonding a bounding pad unit on an integrated circuit chip to a contact unit on a substrate, such as a lead frame or a printed circuit board.
2. Description of the Related Art
FIGS. 1
to
4
illustrate a conventional integrated circuit device and a wire-bonding method for forming the integrated circuit device via a wire bonder (not shown). The integrated circuit device includes a substrate
15
with a contact unit
321
, an integrated circuit chip
31
with a bonding pad unit
311
, and a bonding wire
14
attached to the bonding pad unit
311
and the contact unit
321
. The wire bonder includes a capillary head
11
that feeds the bonding wire
14
, and forms the bonding wire
14
with a solder ball
13
that is attache d to the bonding pad unit
12
during the wire bonding operation (see FIG.
2
). The capillary head
11
then moves along a trajectory (see
FIG. 4
) such that the bonding wire
14
is configured to have a first extension section
32
that extends upwardly in a direction substantially perpendicular to a plane of the substrate
15
, and a second extension section
33
that has a first segment
331
extending downwardly and curvedly from the first extension section
32
, and a second segment
332
extending downwardly and inclinedly from the first segment
331
toward the contact unit
321
and attached to the contact unit
321
via stitch bonding (see FIG.
3
). The trajectory of the capillary head
11
includes a first linear path
3
A that extends upwardly from the solder ball
13
in a direction substantially perpendicular to the plane of the substrate
15
, a second linear path
3
B that extends from the first linear path
3
A in a direction substantially parallel to the substrate
15
away from the contact unit
321
, a third linear path
3
C that extends upwardly from the second linear path
3
B in a direction substantially perpendicular to the plane of the substrate
15
, and a fourth path
3
D that extends downwardly and curvedly from the third linear path
3
C to the contact unit
321
.
The whole configuration of the aforesaid bonding wire
14
permits the bonding wire
14
to possess a high wire strength. Moreover, the first extension section
32
extends upwardly from the solder ball
13
to a level that permits the second extension section
33
to be spaced apart from the integrated circuit chip
31
at a distance that is sufficient to prevent the bonding wire
14
from contacting the integrated circuit chip
31
when the bonding wire
14
is turned downwardly and inclinedly from the first extension section
32
toward the contact unit
321
during formation of the second extension section
33
. However, such configuration of the bonding wire
14
is disadvantageous in that it is not feasible to attach two or more bonding wires, which are to be fed from the capillary head
11
, to the solder ball
13
due to interference of the first extension section
32
with the capillary head
11
. While, additional bonding wires can be attached to the bonding pad unit
311
at positions that are spaced apart from the solder ball
13
in order to avoid the aforesaid interference, such arrangement would enlarge the size of the bonding pad unit
311
and affect adversely design flexibility of an integrated circuit chip.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide an integrated circuit device that includes one or more bonding wires attached to a contact unit on a substrate, such as a lead frame or a printed circuit board, and to a electrical bonding contact attached to a bonding pad unit on an integrated circuit chip.
Another object of the present invention is to provide a wire-bonding method that is suitable for attaching one or more bonding wires to a contact unit on a substrate, such as a lead frame or a printed circuit board, and to a electrical bonding contact attached to a bonding pad unit on an integrated circuit chip.
According to one aspect of the present invention, an integrated circuit device comprises: a substrate having a top side provided with a contact unit; an integrated circuit chip mounted on the substrate and having a top side formed with a bonding pad unit; and a bonding wire interconnecting the bonding pad unit and the contact unit, and having a electrical bonding contact attached to the bonding pad unit, a first extension portion extending from the electrical bonding contact in a direction that inclines slightly and upwardly relative to a plane of the substrate toward the contact unit, and a second extension portion extending from the first extension portion and attached to the contact unit.
According to another aspect of the present invention, a wire-bonding method for bonding a bonding pad unit on an integrated circuit chip to a contact unit on a substrate via a wire bonder that includes a capillary head, comprises the steps of: feeding a bonding wire via the capillary head; forming the bonding wire with a electrical bonding contact that is attached to the bonding pad unit; moving the capillary head along a trajectory such that the bonding wire has a first extension portion extending from the electrical bonding contact in a direction that inclines slightly and upwardly relative to a plane of the substrate toward the contact unit, and a second extension portion extending from the first extension portion toward the contact unit; and attaching the second extension portion to the contact unit.
REFERENCES:
patent: 4950866 (1990-08-01), Kojimqa et al.
patent: 5205463 (1993-04-01), Holdgrafer et al.
patent: 5961029 (1999-10-01), Nishiurta et al.
patent: 5989995 (1999-11-01), Nishiura et al.
patent: 6112974 (2000-09-01), Nishiura et al.
Chuo Te-Tsung
Fang Hui-Chin
Advanced Semiconductor Engineering Inc.
Arbes Carl J.
Greenblum & Bernstein P.L.C.
LandOfFree
Method of wire-bonding circuit chip to bonding pad does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of wire-bonding circuit chip to bonding pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of wire-bonding circuit chip to bonding pad will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2948514