Method of wire bonding a semiconductor die and apparatus therefo

Details Method of wire bonding a semiconductor die and apparatus therefo Method of wire bonding a semiconductor die and apparatus therefo

1982-05-03

1986-04-22

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 45, 228 447, 228232, 219 5621, B23K 3102, H05K 334

Patent

active

045836760

ABSTRACT:
A semiconductor die surface heater and a method of using the die surface heater as a wire bonding assembly are provided. In the preferred form, the semiconductor die surface heater comprises two heaters. A preheater heats the surface of a semiconductor die which is attached to a lead frame via radiant energy. A clamp which positions both the semiconductor die and lead frame during the wire bonding has a window portion with a surface clamp heater for heating at least the portion of the clamp around the window.

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patent: 4351468 (1982-09-01), Floury et al.

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