Method of wave-soldering assembled units

Details Method of wave-soldering assembled units Method of wave-soldering assembled units

1996-04-04

1998-02-24

Heinrich, Samuel M.

Metal fusion bonding

Process

Applying or distributing fused filler

228 37, B23K 306, H05K 334

Patent

active

057204268

ABSTRACT:
A method of wave-soldering assembled units which are conducted over a soldering unit by a transport device including propelling solder against the assembled units in a turbulent zone by a first turbulent soldering wave at an acute angle in the transport direction and subsequently by a quiet soldering wave approximately at right angles thereto. To avoid cold soldered spots and shadow regions, the method includes propelling solder against the assembled units by a second turbulent wave at an acute angle against the transport direction in the turbulent zone. A device for wave-soldering assembled units is also provided.

REFERENCES:
patent: 5156324 (1992-10-01), Hueste et al.
patent: 5228614 (1993-07-01), Elliott et al.
patent: 5292055 (1994-03-01), Gileta
patent: 5379931 (1995-01-01), Van Schaik

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