Method of washing a semiconductor wafer

Details Method of washing a semiconductor wafer Method of washing a semiconductor wafer

2005-03-08

2005-03-08

Lebentritt, Michael (Department: 2824)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S756000, C438S197000

Reexamination Certificate

active

06864187

ABSTRACT:
A nozzle which ejects cleaning solution is disposed above the wafer to be cleaned. The position of the nozzle is such that the cleaning solution ejected from the nozzle drops onto a point on the wafer which is 1 cm or more on this side of the center of rotation. An angle which the direction of ejection of the cleaning solution makes with the wafer surface is set preferably at 5° to 45°.

REFERENCES:
patent: 5725414 (1998-03-01), Moinpour et al.
patent: 5904164 (1999-05-01), Wagner et al.
patent: 5916366 (1999-06-01), Ueyama et al.
patent: 6037201 (2000-03-01), Tsai et al.
patent: 6106369 (2000-08-01), Konishi et al.
patent: 6202658 (2001-03-01), Fishkin et al.
patent: 6330728 (2001-12-01), Ueki et al.
patent: 6332835 (2001-12-01), Nishimura et al.
patent: 6345630 (2002-02-01), Fishkin et al.
patent: 6431185 (2002-08-01), Tomita et al.
patent: 6444582 (2002-09-01), Tsai
patent: 6503333 (2003-01-01), Twu et al.
patent: 6589878 (2003-07-01), Lorimer
patent: 6623355 (2003-09-01), McClain et al.
patent: 6673163 (2004-01-01), Tomita et al.
patent: 0 753 884 (1997-01-01), None
patent: 444241 (2001-07-01), None
patent: WO 9635227 (1996-11-01), None

Affiliated with

Also associated with

Rating

Method of washing a semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of washing a semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of washing a semiconductor wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3415450