Method of wafer level packaging and cutting

Details Method of wafer level packaging and cutting Method of wafer level packaging and cutting

2006-06-28

2008-12-30

Pert, Evan (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

Reexamination Certificate

active

07470565

ABSTRACT:
A packaging wafer has a plurality of cavities and a plurality of trenches on a front surface thereof. The packaging wafer is bonded to the element wafer, and a first cutting method is performed. Afterward a piece of tape is provided and is attached to the packaging wafer. Moreover, a second cutting process is performed and then the piece of tape is removed. Therefore, a wafer level package is formed. In addition, the wafer level package is divided into a plurality of individual packages.

REFERENCES:
patent: 5990566 (1999-11-01), Farnworth et al.
patent: 6476415 (2002-11-01), Walker et al.
patent: 6661084 (2003-12-01), Peterson et al.
patent: 2003/0214007 (2003-11-01), Tao
patent: 2006/0001114 (2006-01-01), Chen
patent: I236111 (2005-07-01), None

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