Method of verifying a layout pattern

Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle – Analysis and verification

Reexamination Certificate

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Details

C716S050000, C716S051000, C716S052000, C716S054000, C716S056000, C430S005000, C430S030000

Reexamination Certificate

active

07913196

ABSTRACT:
A method of verifying a layout pattern comprises separately steps of obtaining a simulated pattern at a lower portion of a film by using a layout pattern as a mask to transfer the layout pattern to the film, and obtaining a simulated pattern at an upper portion of the film by using the layout pattern as a mask to transfer the layout pattern to the film. The layout pattern is verified according to the upper and lower simulated patterns.

REFERENCES:
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patent: 6602728 (2003-08-01), Liebmann et al.
patent: 6893800 (2005-05-01), Jessen et al.
patent: 6934929 (2005-08-01), Brist et al.
patent: 2002/0194576 (2002-12-01), Toyama
patent: 2003/0129509 (2003-07-01), Yamaguchi
patent: 2003/0208728 (2003-11-01), Pierrat
patent: 2003/0224252 (2003-12-01), Zhou et al.
patent: 2004/0139420 (2004-07-01), Brist et al.
patent: 2006/0160023 (2006-07-01), Kobayashi et al.
patent: 2007/0031745 (2007-02-01), Ye et al.
patent: 2007/0097514 (2007-05-01), Matsuzawa et al.
patent: 2008/0204730 (2008-08-01), Yu et al.
“Layout Manufacturability Analysis Using Rigorous 3-D Topography Simulation”, by Andrzej J. Strojwas, Zhengrong Zhu, Dennis Ciplick and Xiaolei Li, IEEE @2001.

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