Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1974-02-04
1976-01-20
Weiffenbach, Cameron K.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 91, 427250, 427404, C23C 1302
Patent
active
039340597
ABSTRACT:
A method of vapor depositing a material onto a substrate results in improved substrate step coverage by the material while keeping the substrate clean by minimizing the evaporation of contaminants onto the surface of the substrate. The method comprises depositing a first layer of material onto the substrate, while the substrate is at a first temperature, heating the substrate to a higher temperature, and then depositing a second layer while maintaining the substrate at the higher temperature.
REFERENCES:
patent: 2812411 (1957-11-01), Moles
patent: 3184329 (1965-05-01), Burns
patent: 3382568 (1968-05-01), Kuiper
patent: 3498818 (1970-03-01), Bahm et al.
patent: 3518506 (1970-06-01), Gates
patent: 3556837 (1971-01-01), Hammond
patent: 3567509 (1971-03-01), Kuiper
patent: 3594214 (1971-07-01), Helwig et al.
patent: 3620837 (1971-11-01), Leff et al.
Christoffersen H.
RCA Corporation
Varndell, Jr. Ralph E.
Weiffenbach Cameron K.
Williams R. P.
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