Method of utilizing a plasma gas mixture containing argon and CF

Details Method of utilizing a plasma gas mixture containing argon and CF Method of utilizing a plasma gas mixture containing argon and CF

1999-03-16

2000-07-25

Ryan, Patrick

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228135, 228177, 228201, B23K 900, B23K 2800, B23K 120, B23K 3102

Patent

active

060927143

ABSTRACT:
A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF.sub.4 to clean and coat a conductor. The method for cleaning and coating a conductor includes the combination of cleaning processes including, physical reduction and chemical reaction and the formation of a polymerization passivation film formed on oxyfluoro metal compositions (SnO.sub.x F.sub.y) which occur during exposure of a conductor to the process of the invention. The polymerization passivation film is formed as a result of the combination of the degraded carbon Tetrafloride (CF.sub.4) gas and degraded environmental and casual hydrocarbons which are present in the form of a variety of unspecified organic contaminants to form crude polymeric molecules in the high energy environment of the plasma. The treatment of conductive surfaces according to the method of the present invention has shown to allow a soldering operation for 3 to 8 hours following treatment without additional preparation, cleaning or treatment.

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