Method of utilizing a contact printing stamp

Details Method of utilizing a contact printing stamp Method of utilizing a contact printing stamp

2008-05-20

2008-05-20

Potter, Roy Karl (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C428S377000

Reexamination Certificate

active

07374968

ABSTRACT:
A method of using a contact printing stamp, including forming a transfer material on a plurality of stamping surfaces. The plurality of stamping surfaces are disposed on a plurality of stamp protrusions adapted from the forming of a stamp material in a plurality of recessed regions formed in an exposed end-region of a multilayer thin film structure.

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