Method of using ultrasonics to plate silver

Details Method of using ultrasonics to plate silver Method of using ultrasonics to plate silver

2005-12-14

2008-09-30

Kim, Vickie (Department: 4172)

Coating processes

Electrical product produced

C427S430100, C427S437000, C205S125000, C205S291000

Reexamination Certificate

active

07429400

ABSTRACT:
A method of reducing solder mask interface attack in a process of fabricating printed circuit boards. The method comprises the steps of providing a printed circuit board with a solder mask applied thereon and treating the printed circuit board with an immersion plating solution, wherein the immersion plating solution is plated onto the printed circuit board with the use of ultrasonics in the plating bath. It has been found that the use of ultrasonics at a frequency of about 40 kHz for the entire plating duration provides beneficial results.

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