Method of using thermal energy absorbing and conducting potting

Details Method of using thermal energy absorbing and conducting potting Method of using thermal energy absorbing and conducting potting

1991-09-30

1993-07-06

Makay, Albert J.

Refrigeration

Structural installation

With electrical component cooling

165 802, 361381, 361388, 174 152, H05K 710

Patent

active

052243567

ABSTRACT:
A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material. According to the method, these materials may be used alone or as a mixture and may be employed as a powder or incorporated into a hardenable matrix such as an epoxy resin.

REFERENCES:
patent: 3549783 (1970-12-01), Bendrick
patent: 3749962 (1973-07-01), Smith et al.
patent: 4911232 (1990-03-01), Colvin et al.
patent: 4915167 (1990-04-01), Altoz
patent: 5007478 (1991-04-01), Sengupta
patent: 5060114 (1991-10-01), Feinberg et al.
patent: 5070040 (1991-12-01), Pankoue

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