Method of using frozen epoxy for placing pin-mounted components

Details Method of using frozen epoxy for placing pin-mounted components Method of using frozen epoxy for placing pin-mounted components

1992-06-26

1993-10-26

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 156299, 174138G, 174260, 439209, 361760, 361767, H05K 334

Patent

active

052554317

ABSTRACT:
Pin-mounted components, such as DIP-packaged devices, multi-pin toroids and memory cubes are integrated into high density interconnect (HDI) structures by external attachment. Frozen spheres of conductive epoxy are placed, using automated pick-and-place equipment, into laser-drilled well-like via holes in an HDI module and then thawed under temperature and vacuum, prior to component pin insertion. Precision dispensing and uniform dispersion of adhesive results.

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