Method of using foamed insulators in three dimensional...

Details Method of using foamed insulators in three dimensional... Method of using foamed insulators in three dimensional...

2006-06-20

2006-06-20

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

07064007

ABSTRACT:
A multichip cube structure having a foamed insulating material disposed between adjacent integrated circuit chips. The foamed insulating material has lower dielectric constant and therefore reduces the capacitive coupling between electrical interconnects on adjacent chips. The foamed insulating material also has higher ductility and lower thermal coefficient of expansion than conventional oxide insulators so as to reduce the occurrence of stress induced cracking in circuitry.

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