Method of using electrically conductive composition

Details Method of using electrically conductive composition Method of using electrically conductive composition

1988-05-27

1989-08-22

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562757, 156330, 252513, 252514, 428414, 428415, 428416, 523457, 523458, B32B 3128

Patent

active

048592684

ABSTRACT:
An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electrically conductive bond between a supporting substrate and a semiconductor.

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patent: 4732702 (1988-03-01), Yamazaki et al.
patent: 4747966 (1988-05-01), Maeno et al.
patent: 4786437 (1988-11-01), Ehrreich
patent: 4797508 (1989-01-01), Chant
patent: 4811081 (1989-03-01), Lyden

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