Method of using an improved solder to bridge a nonmetallic gap b

Details Method of using an improved solder to bridge a nonmetallic gap b Method of using an improved solder to bridge a nonmetallic gap b

1993-01-21

1994-05-03

Heinrich, Samuel M.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

228 563, 2281791, 228189, 2282485, 428608, 428614, 29846, 403271, B23K 3522, B23K 3536

Patent

active

H00013064

ABSTRACT:
An improved solder is provided by imbedding solder with metallized fibers. he improved solder is then used to bridge a nonmetallic gap between two separated metallic surfaces by placing the improved solder on the gap and then applying heat to cause the improved solder to melt and flow and bridge the gap and connect the two separated metallic surfaces.

REFERENCES:
patent: 3676916 (1972-07-01), Schierding et al.
patent: 3973718 (1976-08-01), Deschamps
patent: 4323631 (1982-04-01), Spirig
patent: 4572271 (1986-02-01), Nakashima et al.
patent: 5088007 (1991-02-01), Missele
patent: 5089356 (1992-02-01), Chung

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