Method of using an ID saw slicing machine for slicing a single c

Details Method of using an ID saw slicing machine for slicing a single c Method of using an ID saw slicing machine for slicing a single c

1991-05-15

1993-07-13

Yost, Frank T.

Stone working

Sawing

Rotary

125 1302, B28D 102, B28D 104

Patent

active

052264033

ABSTRACT:
An improved method of using an ID saw slicing machine for slicing a single crystal ingot in a direction normal to the axis of the ingot to obtain wafers. The feed of the single crystal ingot to the blade of the ID saw slicing machine is increased and decreased alternately in accordance with a predetermined control pattern.

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patent: 4949700 (1990-08-01), Ebashi
patent: 5025593 (1991-06-01), Kawaguchi et al.

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