Method of using an electrically conductive elevation shaping too

Metal fusion bonding – Process – With shaping

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228254, 264104, 264322, 438614, B29C 5902, B23K 3102

Patent

active

059841648

ABSTRACT:
The present invention relates to a solder ball shaping tool and a method for using the tool. In a substrate there is formed a series of depressions. The tool is pressed onto a ball grid array and the ball grid array is realigned either with simple pressure or pressure assisted by heating. Where a solder ball may have been deposited upon a die or a chip package in a diameter that exceeds that of the designed diameter, a corral tool is used to substantially conform the solder ball to design dimensions and a design location. As the corral tool is pressed against the solder ball, portions of the solder ball will reflow both into the substrate depression and into the corral. Where the total volume of the solder ball does not exceed that of both the corral and the substrate depression, the corral tool is adequate to achieve a designed solder ball height.

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Chip Scale BGA, Smaller IC Packages for bigger Performance, amkor/anam, Super BGA.RTM. & IC Packaging For Super BGA.RTM., (advertisement) (no date).

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