Method of using a projection aligner for photoetching

Details Method of using a projection aligner for photoetching Method of using a projection aligner for photoetching

1989-02-09

1990-02-27

Dees, Jose G.

Gas: heating and illuminating

430 22, 430311, 355 77, G03C 500

Patent

active

049045709

ABSTRACT:
When a circuit pattern for a semiconductor device is exposed on a substrate with a coating of photoresist by using a projection aligner with positioning pads to properly position the substrate, photoresist is removed from such areas on the substrate that are expected to come in direct contact with the pads. The removing is effected before the substrate is exposed so that accumulation of photoresist on the pads can be prevented and substrates to be exposed subsequently can also be positioned accurately by using the projection aligner.

REFERENCES:
patent: 4068947 (1978-01-01), Buckley et al.
patent: 4198159 (1980-04-01), Cachon
patent: 4518678 (1985-05-01), Allen

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