Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1979-03-12
1980-11-25
Wityshyn, Michael G.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
138155, 138DIG1, 156320, 156574, 156579, 219245, 1563099, 1563244, C09J 510, C09J 700
Patent
active
042356520
ABSTRACT:
A low profile heat sealing iron for use in applying heat activatable tape in areas of very limited access, such as the sealing of periodic joints in air duct is disclosed. The low profile sealing iron requires only a few inches or less of clearance and has a tape guiding means that feeds the tape to the proper location for heat sealing as the iron is slid along the surface of the member on which the tape is being applied. Preferably, the iron has a handle of adjustable length which permits the sealing iron to be used on ducts measuring six to eight feet or more when the handle is extended, but having a handle only about three feet long or less for easy carrying and handling at other times. A method of using the low profile sealing iron to seal joints in air ducts is also disclosed.
REFERENCES:
patent: 2609316 (1952-09-01), Fichtner
patent: 2703133 (1955-03-01), Payton
patent: 2709742 (1955-05-01), Perry
patent: 2759618 (1956-08-01), Vogt
patent: 2814710 (1957-11-01), Schuetze
patent: 3390673 (1968-07-01), Ernst
patent: 3619333 (1971-11-01), Mender
patent: 3972768 (1976-08-01), Hill
Brooks Ray G.
Smith Harvell M.
Anderson William C.
Johns-Manville Corporation
Kelly Joseph J.
Krone Robert M.
Wityshyn Michael G.
LandOfFree
Method of using a low profile heat sealing iron does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of using a low profile heat sealing iron, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of using a low profile heat sealing iron will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1128107