Method of upgrading memory boards

Details Method of upgrading memory boards Method of upgrading memory boards

1985-09-03

1986-12-30

Lin, Kuang Y.

Metal fusion bonding

Process

Repairing, restoring, or renewing product for reuse

228179, 29829, 29840, B23K 3102, H05K 300, H05K 334

Patent

active

046322930

ABSTRACT:
A simple method of upgrading memory boards containing soldered memory chips by upward pin compatible memory chips with more memory. The new memory chips are soldered over the original memory chips after the power pins of the original chips have been disconnected and insulated from the original chips. This method is particularly useful for upgrading type "4164" 64Kb DRAM chips by type "4256" 256Kb DRAM chips.

REFERENCES:
patent: 3406246 (1968-10-01), Davidson et al.
patent: 3912984 (1975-10-01), Lockhart, Jr. et al.

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