Method of uniformly encapsulating a semiconductor device in resi

Details Method of uniformly encapsulating a semiconductor device in resi Method of uniformly encapsulating a semiconductor device in resi

1992-04-30

1994-12-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437220, 26427217, 257667, H01L 2156, H01L 2158, H01L 2160

Patent

active

053710444

ABSTRACT:
A molding method in which a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage are disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.

REFERENCES:
patent: 4641418 (1987-02-01), Meddles
patent: 4894704 (1990-01-01), Endo
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5086018 (1992-02-01), Conru
Japanese Patent Unexamined Publication No. 60-154546.
Japanese Patent Unexamined Publication No. 60-200552.

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