Method of ultrasonic-mounting electronic component and...

Details Method of ultrasonic-mounting electronic component and... Method of ultrasonic-mounting electronic component and...

2007-04-24

2007-04-24

Sells, James (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S073100, C156S358000, C156S580100

Reexamination Certificate

active

11041375

ABSTRACT:
The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.

REFERENCES:
patent: 2004/0211812 (2004-10-01), Hizukuri et al.
patent: 2002-217242 (2002-02-01), None

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