Method of ultrasonic mounting and ultrasonic mounting...

Details Method of ultrasonic mounting and ultrasonic mounting... Method of ultrasonic mounting and ultrasonic mounting...

2005-02-23

2008-09-16

Lorengo, Jerry (Department: 1793)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S001100, C156S073100

Reexamination Certificate

active

07424966

ABSTRACT:
A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip52to a substrate50using an ultrasonic mounting apparatus including a horn15that propagates ultrasonic vibration of an ultrasonic vibrator, the horn15being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate50on a stage13, disposing the semiconductor chip52on the substrate50, and placing the semiconductor chip52in contact with a convex part15aprovided on the horn15and applying ultrasonic vibration to bond the semiconductor chip52to the substrate50.

REFERENCES:
patent: 5820011 (1998-10-01), Ito et al.
patent: 2003/0019561 (2003-01-01), Tominaga et al.
patent: 2004/0190733 (2004-09-01), Nayar et al.
patent: 2004-047692 (2004-02-01), None
patent: 2004-087539 (2004-03-01), None

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