Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
1999-03-19
2001-02-20
Young, Lee (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S593000, C029S835000, C029S847000, C029S853000, C451S120000, C451S178000, C451S541000, C451S548000
Reexamination Certificate
active
06189201
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to printed resonance circuits, more particularly to a method of tuning a high frequency printed resonance circuit.
2. Description of the Related Art
High frequency printed resonance circuits are generally employed in radio devices, such as transmitters and receivers, filters, etc. Presently, there are two known methods of tuning a printed resonance circuit. The first method involves cutting of a conductive layer, which serves as the inductance of the resonance circuit, to change the length or geometry of the same, thereby mechanically correcting the circuit inductance. The second method involves laser burning of the conductive layer. The first method is inaccurate and troublesome. Although the second method is more accurate and more convenient to use than the first method, the second method requires a high temperature resistant dielectric substrate material, such as ceramic materials, for the resonance circuit. Application of the second method on resonance circuits printed on other widespread dielectric substrate materials, such as composite or glass-epoxy, is impossible.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide a method of tuning a high frequency printed resonance circuit that can be applied to most widespread dielectric substrate materials.
According to the present invention, a method of tuning a high frequency printed resonance circuit having a conductive layer that is printed on a dielectric substrate and that serves as an inductance of the resonance circuit, comprises the step of grinding the conductive layer to mechanically remove a portion thereof from the dielectric substrate via a grinding pin that is rotated about a rotary axis perpendicular to a major printed surface of the dielectric substrate, thereby correcting the inductance of the resonance circuit and tuning the resonance circuit.
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Krzemieniewski Henryk
Trzaskowski Czeslaw
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Sino Dragon Inc.
Tugbang A. Dexter
Young Lee
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